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Senior Packaging Engineer

IC Resources
Posted a month ago, valid for 5 days
Location

Oxford, Oxfordshire OX1 1HB, England

Salary

Competitive

Contract type

Full Time

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Sonic Summary

info
  • Our client is seeking a Packaging Engineer to join their photonics operations team.
  • The role involves collaborating with engineering and product development teams to specify packaging solutions for volume manufacturing.
  • Candidates should have experience with assembly packaging techniques and knowledge of semiconductor device manufacturing steps.
  • A Master's degree in a relevant technical field is required, along with strong communication skills.
  • The position offers a competitive salary of $100,000 and requires at least 5 years of relevant experience.
Our cutting edge client is currently searching for a Packaging Engineer to join the photonics operations team. The role will involve working with engineering and product development teams to specify required packaging solutions required for volume manufacture. Working with vendors to select and qualify assembly processes will be required as well as coordinating day to day management of external vendors.

Required skills for the Packaging Engineer will include:
  • Experience with assembly packaging techniques including dicing, die attach, flip chip, wire bonding etc
  • Knowledge of semiconductor device manufacturing steps and high-volume testing and packaging and product development.
  • Photonics packaging experience desirable
  • Strong communication skills
  • Masters degree in a relevant technical field
Please contact Rachel Anderson for further details.

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In order to submit this application, a TotalJobs account will be created for you. As such, in addition to applying for this job, you will be signed up to all TotalJobs’ services as part of the process. By submitting this application, you agree to TotalJobs’ Terms and Conditions and acknowledge that your personal data will be transferred to TotalJobs and processed by them in accordance with their Privacy Policy.