Back to search
Job Description
Intel's recently announced IDM 2.0 strategy includes a plan to significantly expand the manufacturing network, establishing new capacity and capability to meet the accelerating global demand for semiconductors. The Disaggregated Manufacturing Organization (DMO) will play an important role in this strategy, with New Mexico Foundry Operations a key component of this effort. The Integration Manager's top deliverables will be to meet Qualification, Yield, and Cost requirements for the technology, for either the Front-End of the process for IFS (Intel Foundry Services). Responsibilities include the following but are not limited to: Define process flow to meet device, electrical, and structural requirements including yield and defectivity. Set module process requirements (MTS) and segment requirements Ensure timely delivery from modules of key module deliverables: equipment/material definition, process recipes meeting MTS with sufficient stability and process window, tool qual and monitoring procedures, run rules, queue times, PM and RFC specs and procedures, process and equipment monitors (SPC and FDC charts and limits), qualified TW and rework routes including re-use, capacity model inputs to IE, cost models including HC. Manage pre-qual WIP, allocate to segments Coordinate mask delivery and ensure all required information is provided before tape out (frame definition and OPC) Work with the device team to define and implement processes to meet device requirements Own (D) process change control with input from yield, reliability, IE, and module teams. The ideal candidate will exhibit the following behavioral traits: Effective communicator up and down the organization. Skills to motivate and drive toward a high-performing, large organization. Demonstrated results and accountability for broad leadership, the building of followership, and role modeling of Intel values and cultural attributes. Must be a self-starter, highly organized, and have the ability to work independently across organizations. Synthesize complex problems into clear messages and proposals through presentations, as well as communicating throughout the organization and factory. Lead problem-solving efforts and exert influence with other organizations and management. Interpersonal and relationship-building skills with peers, stakeholders, and customers Lead and develop individuals, managers, and teams. Provide technical and tactical direction.
Qualifications
You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
Minimum Qualifications
Â
The candidate must possess a:
- Bachelor's degree in an Engineering or Physics/EE/Chemistry/Material Science related field with 6 years of relevant experience, or
- Master's degree in an Engineering or Physics/EE/Chemistry/Material Science related field with 4 years of relevant experience, or
- Ph.D. degree in an Engineering or Physics/EE/Chemistry/Material Science related field with 2 years of relevant experience
- OR in lieu of the degree, the following years of direct experience:
- 10+ years of direct wafer fabrication and high-volume factory experience with a strong technical background.
- 7+ years of yield or engineering management experience.
Must be willing to relocate to New Mexico.
Preferred Qualifications:
- Detailed understanding of MBPS as well as fab process control systems and methodologies.
- Working knowledge of device physics and process technologies.
- Experience at the group leader level is also desired but not a requirement, including management of engineering exempts/non-exempts;
- Experience working through all aspects of the planning/execution of 300mm startup of semiconductor process technologies;
- Planning/execution of process improvement roadmaps
Inside this Business Group
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth.
Posting Statement
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Benefits
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here.
Annual Salary Range for jobs which could be performed in the US $160,190.00-$226,150.00
*Salary range dependent on a number of factors including location and experience
Working Model
This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.
Learn more about this Employer on their Career Site
