Microelectronic Technician 2

At Northrop Grumman, our employees have incredible opportunities to work on revolutionary systems that impact people's lives around the world today, and for generations to come. Our pioneering and inventive spirit has enabled us to be at the forefront of many technological advancements in our nation's history - from the first flight across the Atlantic Ocean, to stealth bombers, to landing on the moon. We look for people who have bold new ideas, courage and a pioneering spirit to join forces to invent the future, and have fun along the way. Our culture thrives on intellectual curiosity, cognitive diversity and bringing your whole self to work — and we have an insatiable drive to do what others think is impossible. Our employees are not only part of history, they're making history. Join Northrop Grumman on our continued mission to push the boundaries of possible across land, sea, air, space, and cyberspace. Enjoy a culture where your voice is valued and start contributing to our team of passionate professionals providing real-life solutions to our world’s biggest challenges. We take pride in creating purposeful work and allowing our employees to grow and achieve their goals every day by Defining Possible. With our competitive pay and comprehensive benefits, we have the right opportunities to fit your life and launch your career today. We are looking for you to join our team as a Microelectronic Technician to join our team in Apopka, FL. The Technician will perform a variety of technical, chemical, and photolithography duties with the development, processing, and control of semi-conductor material and devices. What You’ll Get to Do: Run fabrication equipment for processing semiconductor materials and devices under the guidance of process documentation which includes the set-up and operation of a variety of standard and special solid-state processing equipment. This includes performing various chemical, physical, photographic, and packaging processes such as deposition, evaporations, and etching of materials, metals plating, wafer dicing /thinning, and making/requesting adjustments based upon the knowledge of process and procedures, and monitoring equipment when applicable. Examine processes such as resist/develop processing, photo exposure, metallization, and etching to determine the quality of the process to locate defects. Determine and discuss with the engineer possible improvements in process or equipment to remedy defects. Interpret SPC (Statistical Process Control) charts to react to out-of-control conditions to maintain process control. Prepare reports or parts of reports following established patterns. Covering work assignments such as preparing masks, operating photographic equipment, and developing photographic requirements. Placing lots on hold, based on engineering guidance, disposition lots, and document in MES. Performing tasks such as running split lots for engineering, and ensuring special processing is consistent and on time. Performing gage R&R (Repeatable & Reproducibility) studies for metrology equipment. Ability to lift, hold, move, and manipulate the wafers in a FOUP (Front Opening Unified Pod) to 25 pounds and with a wand as applicable. Basic Qualifications: High school graduate or recognized equivalent. Associate’s degree or two years (minimum 60 semester hours) of college-level study with a major in a physical science or equivalent; or 2 years of relevant experience. Experience in manufacturing and semiconductor (cleanroom) Manufacturing U.S. citizenship Ability to obtain and maintain a Department of Defense (DoD) Secret clearance Preferred Qualifications: Experience running semiconductor process equipment and metrology equipment. Experience in data collection and interpretation Wafer handling experience, placing lots on hold, and disposition of held material. Security Clearance.